High Power Expanded Plasma Cleaner

With twice the cleaning rate as the Expanded Plasma Cleaner, the High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm) as well as surface cleaning and modification. Features: Larger, benchtop unit Adjustable RF power settings (Low, Medium, High) Maximum RF power of 45W Low RF power setting is equivalent to High RF power setting on PDC-001/PDC-002 Includes a 6″ diameter x 6.5″ length Pyrex chamber Hinged door with viewing window Active fan cooling Integral switch for a vacuum pump 1/8″ NPT metering valve to qualitatively control gas flow and vacuum pressure 1/8″ NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting Weight: 37 lbs Size: 11″ H x 18″ W x 9″ D Optional PlasmaFlo gas mixer allows quantitative control of up to two (2) process gases and monitoring of chamber pressure Optional quartz chamber and sample tray Compatible vacuum pump available Requirements Our Plasma Cleaners require a vacuum pump with a minimum pump speed of 1.4 m3/hr (23 L/min) and ultimate total pressure of 200 mTorr (0.27 mbar) or less For pumping nonreactive gases (air, N2, Ar), see our Standard Vacuum Pumps. For pumping concentrated or pure oxygen gas, see our Oxygen Service Pumps.